Erni has turned its attention to a technology where no further development seemed possible and has managed to achieve a significant improvement. Its Ercom (DIN 41612/IEC 603-2) connectors now feature a new contact design with reciprocal contacts, offering significant benefits:
* A high degree of functional safety, high reliability.
* Low crosstalk level.
* Significantly improved HF characteristics.
The Ercom series features three types: C type with 64 and 96 pins, CD type with 128 pins and E type with 160 pins, available with or without a flange in either solderless press-fit technology (complete with an elastic Ernipress zone); or for dip soldering when four integrated cranked terminations provide exact positioning during the soldering process. A further benefit is the easy plug-in coding strip which audibly engages and locks into position by means of a snap-in system.
What is an RF launch? Spectrum Concepts
Interconnection
As signal speeds increase, each part of the signal path getting to and from the device needs to work to higher frequencies, and strategies that worked in the past no longer suffice. A Samtec webinar will demystify this topic.
Read more...High-speed high-density connectors from Withwave RFiber Solutions
Interconnection
The high-speed high density open pin field array connectors have excellent higher bandwidth applications and are capable of data throughput of up to 112 Gbps.
Read more...Actum Group leads in the interconnect industry Actum Electronics
News
Actum Group is a specialist importer and distributor of industrial and electronic products in Southern Africa and a leader in the interconnect industry.
Read more...Build a high-speed board-to-board mated set in under a minute Spectrum Concepts
Interconnection
The latest implementation of Samtec’s Solutionator now covers the high-speed board-to-board products with the High-Speed Board-to-Board Solutionator to present a full mated set solution.
Read more...Clearing the Static: ESD wrist straps Actum Electronics
Circuit & System Protection
The human body is the primary source of electrostatic charge generation. In order to control and reduce static charge build-up and prevent electrostatic discharges (ESD) at an electronic equipment facility, we use grounding systems to ensure that all components are at the same electrical potential.
Read more...Low-PIM cable assembly application considerations RF Design
Interconnection
Given the diverse range of applications for coaxial cable assemblies, these cables are not one-size-fits-all. This article discusses three main types, low-PIM, low-loss, and phase-stable coaxial cable assemblies.
Read more...The new VITA 90 landing page
Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.
Read more...The new VITA 90 landing page Spectrum Concepts
Interconnection
Samtec has launched its new landing page for the small form factor VITA 90 standard comprising rugged modules with a focus on size, weight and power.
Read more...New precision standoffs for ultra-rugged applications Spectrum Concepts
Interconnection
Samtec has launched its new precision PCB standoffs used to either separate printed circuit boards, or to create space between the PCB and the mounting chassis.
printer friendly version