Diamond Systems has unveiled Magellan, a board-level ‘embedded-ready subsystem’ (ERS) that combines the benefits of computer-on-modules (COMs) with those of stackable single-board computers (SBCs). This solution means system manufacturers do not need to design a custom carrier to deploy COM Express modules.
Magellan's CPU core consists of a COM Express CPU module and heat-spreader mounted on its bottom side, resulting in enhanced thermal management and increased space for I/O functions and connectors. This design makes it possible for the system to integrate dual gigabit Ethernet LAN ports, a 7-30 V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion, and a FeaturePak I/O module socket, in addition to a complete embedded-PC core – all within the 95 x 125 mm COM Express footprint. Stacking boards in one direction simplifies the thermal design of embedded systems based on high-end CPUs, avoiding costly custom heat pipes and milled aluminium thermal-transfer blocks.
Magellan is offered in a range of models that vary according to the choice of COM Express CPU module and SDRAM capacity (socketed or soldered-on). It can be used either as a highly integrated embedded component, or as a platform for application development and reference designs. The baseboard includes connectors and interfaces for USB, serial, gigabit Ethernet, audio and SATA mass storage devices. It also supports the connection of a wide variety of displays, including CRTs, LVDS-interfaced flat panels and televisions.
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