Texas Instruments has added two new devices, the TMS320C5514 and TMS320C5515, to its low-power 16-bit digital signal processor (DSP) C5000 platform. Also available are two evaluation options including the full-featured TMDXEVM5515 evaluation module and the new low-cost TMDX5515EZDSP.
The new DSPs provide a 20% performance increase, up to 120 MHz, with higher integration to ease system level development. This allows designers to maintain low power levels while adding features such as additional encode and decode algorithms in voice, audio and portable communications applications, as well as more real-time diagnostics in medical end equipments. These devices also integrate power management features, such as on-chip LDOs (low-dropout regulators), as well as dynamic voltage and frequency scaling, so customers can maximise and efficiently manage battery life for portable devices.
The C5514 features three on-chip LDOs, one each for the DSP core, USB and analog subsystems. It includes SDRAM and mobile SDRAM support for power sensitive applications. The peripheral set includes high-speed USB 2.0, I²S, UART, SPI, MMC/SD and GPIOs. Up to 256 KB of on-chip memory saves both power and system cost by reducing the need for external memory, while dynamic voltage and frequency scaling help to maximise battery life in portable applications.
In addition to the C5515’s features, the C5515 offers an additional 64 KB on-chip memory (320 KB total), up to 1024-point programmable FFT hardware accelerator, integrated LCD display controller and 10-bit 4-channel SAR ADC. It is scalable and pin-compatible with the C5514.
Flash memory devices for high-capacity mobile storage
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KIOXIA has begun sampling new Universal Flash Storage Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell technology.
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Microchip Technology has again expanded its maXTouch M1 family of touchscreen controllers, now covering free-form widescreen format displays up to 42 inches down to small compact screens in the 2 to 5 inch range.
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Specifically designed for long-range, multitarget measurements, the VL53L4CX from ST Microelectronics provides very accurate distance measurements up to 6 m with excellent results over short distances.
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With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
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i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
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Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
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