Computer/Embedded Technology


SBCs in SUMIT-ISM format

28 April 2010 Computer/Embedded Technology

Adlink has demonstrated its support for the ISM and SUMIT standards with the CoreModule range of embedded PC/104 SBCs (single board computers).ISM, short for industry standard module, is a pure 90 x 96 mm form factor (compatible with PC/104) that addresses shortcomings of existing small form factors, such as:

* Fitting circuitry without extending beyond the board outline.

* Meeting top- and bottom-side component height restrictions.

* Decoupling form factors from expansion interfaces.

* Enabling flexible expansion bus and I/O connectorisation.

* Allowing bus combinations that were previously undefined and unnamed.

SBC manufacturers have struggled to fit modern legacy-free platforms onto small form factors without protruding beyond the allowed board outlines with ‘wings’. With the ISA bus, serial ports and even the PCI bus no longer integrated into lowpower chipsets, it takes extra circuitry to meet the needs of many embedded applications. The ISM specification defines the board size, four fixed mounting holes, component height limits and flexible ‘expansion zones’ for I/O and/or bus connectors. The fixed corner mounting holes allow re-use of enclosures without modifications in the future.

ISM allows many combinations of bus and I/O connectors as long as those interfaces reside within the defined expansion zones. ISM also offers a choice of using right-angle connectors that overhang the board edges, or extending the circuit board if vertical/non-overhang connectors are used. ISM boards can be SBCs, stackable CPU and I/O cards, and even computer-on-modules (COMs). This flexibility allows easy migration from SBCs to COMs and vice versa, or from processor to processor, while preserving investments in mechanical designs.

SUMIT is one of many board-to-board expansion interfaces that are permitted with ISM. SUMIT, short for stackable unified module interconnect technology, offers PCI Express, USB, SPI, I²C and LPC Bus expansion using 52-pin, high-bandwidth, rugged Samtec Q2 series connectors. This mix of high-speed and low-speed buses simplifies the task of attaching many types of I/O without complex bridges and software.

An independent standards organisation called the Small Form Factor Special Interest Group, or SFF-SIG, creates, adopts and maintains a number of emerging standards for the low-power, small form factor market. As consumer technology is often inappropriate for the embedded market, the standards feature reusable modular building blocks, developed by embedded vendors for embedded OEMs. Many of these are optimised for ultra low-power processors and controllers, yet scale up to multicore processor environments. The ISM and SUMIT standards fall within this organisation’s purview.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Intelligent video processing
Rugged Interconnect Technologies Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.

Read more...
Quectel’s single-board computers put industrial edge computing on one PCB
iCorp Technologies Computer/Embedded Technology
Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.

Read more...
Nordic expands nRF Cloud with firmware vulnerability scanning
RF Design Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.

Read more...
Arrival of the Epic-PTH9
Vepac Electronics Computer/Embedded Technology
AAEON introduces the EPIC-PTH9, a compact 4-inch industrial single-board computer powered by Intel Core Ultra Series 3 (formerly Panther Lake) processors.

Read more...
EPS-9600 Managed Layer 3 Ethernet Switch with next-generation Time- Sensitive Networking
Electronic Products Design Computer/Embedded Technology
Diamond Systems has introduced EPS-9610 (part of the EPS-9600 family), a rugged, ultra-compact embedded Ethernet switch which integrates military-grade ruggedness with next-generation Time-Sensitive Networking (TSN) capabilities.

Read more...
An industry-first Android 16 smart module solution
RF Design Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.

Read more...
Accelerate STM32-based IoT development with SPI EEPROM board
Altron Arrow Computer/Embedded Technology
ST Microelectronics’ ready-to-use STM32 expansion board helps design more efficient battery-friendly IoT devices based on ultra low power 32-Mbit Page.

Read more...
Unleash the next generation of Intel Core power
Vepac Electronics Computer/Embedded Technology
The EPIC-BTS9 from AAEON, is tailor-made to bring unprecedented performance to smart manufacturing and industrial robotics.

Read more...
QMC series I/O modules for VITA 93 small form factor mezzanine
Rugged Interconnect Technologies Computer/Embedded Technology
The new line of VITA 93 QMC mezzanine modules, from Acromag, are engineered to meet increasing demands for smaller form factors and more performance.

Read more...
MIKROE celebrates 2000th Click board
Computer/Embedded Technology
MIKROE has launched its 2000th Click board, the RTC 27 Click, designed for low-power real-time clock and calendar functionality, time tracking, alarm event generation, watchdog timing, and timestamp capture.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved