Vishay has announced a new series of ceramic LED submounts designed to provide thermal management for high-power (>1 W) LED devices. The LSUB series offers low thermal resistance down to 3 K/W. Optimised for high-power LEDs and laser diodes in automotive, industrial and home applications, LSUB devices are designed to minimise the thermal resistance between the die and the package termination. The LSUB’s enhanced thermal design enables a lower junction temperature and increased efficiency and reliability.
The LSUB series is available in two configurations: a standard configuration designed for conductive epoxy or thick solder (greater than 12 μm) die attach methods, and an offset configuration designed for thin solder layers in the 2 μm to 3 μm range. The LSUB is designed to accommodate high-power LED dice that are approximately 1 by 1 mm. The pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
The package bases are offered as singulated individual die or in square arrays. Additional LED configurations and form factors are available upon request. The LSUB is offered packaged in waffle packs or in wafer form for automatic die assembly.
Next-gen robotic systems initiative EBV Electrolink
Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Touch-enabled 32-bit MCU EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...High-performance FPGA family EBV Electrolink
DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Automotive Ethernet communications EBV Electrolink
News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version