Vishay has announced a new series of ceramic LED submounts designed to provide thermal management for high-power (>1 W) LED devices. The LSUB series offers low thermal resistance down to 3 K/W. Optimised for high-power LEDs and laser diodes in automotive, industrial and home applications, LSUB devices are designed to minimise the thermal resistance between the die and the package termination. The LSUB’s enhanced thermal design enables a lower junction temperature and increased efficiency and reliability.
The LSUB series is available in two configurations: a standard configuration designed for conductive epoxy or thick solder (greater than 12 μm) die attach methods, and an offset configuration designed for thin solder layers in the 2 μm to 3 μm range. The LSUB is designed to accommodate high-power LED dice that are approximately 1 by 1 mm. The pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.
The package bases are offered as singulated individual die or in square arrays. Additional LED configurations and form factors are available upon request. The LSUB is offered packaged in waffle packs or in wafer form for automatic die assembly.
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