Manufacturing / Production Technology, Hardware & Services


Solder reflow oven

12 May 2010 Manufacturing / Production Technology, Hardware & Services

Mekko’s new Euroflow 300C solder reflow oven design includes a new heater control system designed to overcome the problem of varying temperatures across the substrate, encountered with lead-free soldering.

The oven is divided into three closed-loop PID temperature controlled zones along its length (pre-heat, soak and reflow), while the heating zones (pre-heat and reflow) are further divided into three sections across the conveyor. In the pre-heat section there are three zones of heat control across the conveyor (ie, front edge, centre and back edge). In the soak (or stabilisation) zone there is one zone of control. In the reflow zone there are again three zones of heat control across the conveyor, for a total of seven zones. This enables the operator to easily overcome the problem of temperature variation across the substrate.

The machine measures 1680 mm in length, 600 mm in width and 470 mm in height, and incorporates a 300 mm wide stainless steel ladder type mesh conveyor belt. The full heated length is 900 mm, plus a cooling zone of 300 mm. The processing chamber combines the benefits of forced hot air convection with fast response heater panels.

The oven is run from a computer control system, which is used to create and store programs for different product applications. The operator can load a program to control the set temperatures and the conveyor belt speed. The monitor will display the oven conditions, with colour graphics of each zone temperature. An on-screen profile display of substrate temperature is provided, using up to three extended k-type thermocouples. The graphs may be saved and printed on paper.



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