Diamond Systems has unveiled the world’s first data acquisition (DAQ) I/O module compatible with the newly introduced FeaturePak embedded I/O expansion module standard. Despite its diminutive size, the FP-DAQ1616 integrates Diamond’s newest and fastest analog I/O technology, and interfaces to host systems via the FeaturePak host interface’s high-speed PCI Express bus interface.
The board provides sixteen 16-bit A/D inputs, sampling at 2 MHz and supported with a 16 kilosample FIFO for reliable data collection in any environment. Advanced A/D features include programmable input ranges, polarity, mode and FIFO threshold. The module also offers sixteen 16-bit D/A output channels, with programmable range and polarity. It incorporates auto-calibration technology with independent calibration factors for each input and output range, which ensures maximum A/D and D/A accuracy across all operating modes and throughout the entire -40°C to +85°C extended operating temperature range.
Other features provided by the FP-DAQ1616 include seven 8-bit digital I/O ports (with a mix of bit-wide and byte-wide direction control), two 32-bit up/down counter/timers with programmable input source and gate, four 24-bit pulse-width modulation circuits with 0-100% duty cycle, and a watchdog timer.
Diamond supplies a universal driver software toolkit at no extra charge with the board, to ease the task of supporting its data acquisition functions in applications under Linux, Windows XP, Windows Embedded Standard and Windows Embedded CE. The toolkit also includes demo programs and example code for each supported OS.
Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Eskom announces PV registration extension
Computer/Embedded Technology
The South African Photovoltaic Industry Association has welcomed Eskom’s decision to extend its zero-registration fee policy and free smart meter installation for residential Small-Scale Embedded Generation customers until March 2026.
Read more...Unlock enhanced wireless performance
Computer/Embedded Technology
Duxbury Networking has introduced Cambium Networks’ Deep Virtual Circuit (Deep VC) technology, a free upgrade for the PMP 450 platform that will transform wireless broadband performance across the country.
Read more...Computing in industrial environments Vepac Electronics
Computer/Embedded Technology
The Panasonic Toughbook CF-33/CF33 Tablet is a 12,0-inch fully rugged device with hot-swappable twin batteries and highly configurable capabilities.
Read more...DDR5 DRAM series Vepac Electronics
Computer/Embedded Technology
Innodisk has announced its DDR5 6400 DRAM series featuring the industry’s largest 64GB single-module capacity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version