Cypress Semiconductor has introduced 32 Mbit and 64 Mbit fast asynchronous SRAMs which offer very fast response times and small footprint. They target applications such as storage servers, switches and routers, testing equipment, high-end security systems and military systems.
The CY7C1071DV33 32 Mbit 3 V and CY7C1081DV33 64 Mbit 3 V devices offer both 16-bit and 8-bit I/O configuration, and access times of 12 ns. They are available in RoHS-compliant 48-BGA packages with a footprint of 8,0 x 9,5 x 1,2 mm and 8,0 x 9,5 x 1,4 mm, respectively. The SRAMs are fabricated using Cypress’s high-performance, 90 nm C9 CMOS technology.
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NKK’s new easy installation Panel Mount Assembly (the BYB201-470) consists of a PCB, resistor, connector, and a straight PC adaptor.
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The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
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The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
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The AQY221R2SX and AQY221R2S PhotoMOS from Panasonic Industry ensures excellent characteristics and high-speed switching performance.
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Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...EEPROMs for industrial and military markets Vepac Electronics
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Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.
Read more...PLCnext – Open, IIoT-ready industrial platform IOT Electronics
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PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.
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Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
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