7 July 2010Manufacturing / Production Technology, Hardware & Services
DEK’s ProFlow system for enclosed head printing technology has evolved to deliver greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.
With the ability to accommodate all solder pastes, ProFlow ATx combines a low-volume print chamber with an innovative paste loading mechanism, facilitating consistent process control and performance. Within the print chamber, the system’s conditioning grid actively conditions the solder paste materials and the system subsequently delivers a robust paste roll for precise aperture filling. ProFlow ATx’s direct, automatic loading from industry standard packaging assures that manual intervention is minimised. Materials are contained in a sealed environment, thus reducing waste.
20 years of precision, progress and purpose – the Jemstech journey Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...An argument to redefine IPC class definitions for class 1, 2, & 3 electronics MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...Large platform stencil printer Techmet
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GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...Press-fit component inspection MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...A new era in wire bond inspection Techmet
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
Read more...Mycronic’s MYPro A40 pick-and-place solution MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
Mycronic’s MYPro A40 pick-and-place solution, equipped with an MX7 high-speed mounthead technology, increases top placement speeds by 48% over the previous generation.
Read more...Why ergonomics matters in digital microscopy TANDM
Manufacturing / Production Technology, Hardware & Services
While magnification technology has kept pace with demand, the wellbeing of the people behind the microscopes has often been overlooked with technicians spending long hours in intense focus, leading to chronic strain, fatigue, and costly mistakes.
Read more...From ER to effortless: The 15-year journey of Seven Labs Technology Seven Labs Technology
Editor's Choice Manufacturing / Production Technology, Hardware & Services
What started as a business likened to an ‘ER’ for electronic components has today grown into a trusted partner delivering kitting services and full turnkey solutions – taking the effort out of electronics and helping customers truly ‘Move to Effortless.’
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