13 October 2010Manufacturing / Production Technology, Hardware & Services
APS Novastar has unveiled a new solution for automated selective soldering with the introduction of its ESS selective soldering machines. Specifically designed for assemblers wanting to make the transition from manual or semi-automatic to automated selective soldering, the new machines provide a new entry point in cost-effective, easy to operate options for short run, batch selective soldering applications.
The ESS310 and ESS500 provide robust systems for batch processing of mixed technology boards that require selective soldering of through-hole components. The flexibility to perform single point, drag, mini-wave or dip soldering, increases solder joint quality and board throughput. These all-inclusive systems, with onboard flux, preheat and omnidirectional soldering, are also easy to program with onboard touch screen, microcontroller and intuitive programming software. For increased throughput, off-line programming and photoscan software are also available.
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Brady’s ‘RFID Labels/Smart Labelling’ offering positions itself as a turnkey way to attach a digitally-enabled identity to physical assets.
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Mycronic’s PCB Assembly Solution division has announced the launch of GenI, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection programming.
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As industries embrace the era of smart automation, Siemens has introduced a groundbreaking innovation – the Inspekto AI-based visual inspection system.
Read more...Transparent rigid PCBs launched on PCBWay PCBWay
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[Sponsored] PCBWay is thrilled to announce a highly anticipated new service - transparent rigid PCBs – a combination of technology and aesthetics.
Read more...20 years of precision, progress and purpose – the Jemstech journey Jemstech
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Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...An argument to redefine IPC class definitions for class 1, 2, & 3 electronics MyKay Tronics
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One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...Large platform stencil printer Techmet
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GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
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In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...A new era in wire bond inspection Techmet
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Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
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