13 October 2010Manufacturing / Production Technology, Hardware & Services
Laird Technologies announced the release of its new Tflex XS400 series, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2,0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Available in thicknesses from 0,50 mm through 5,0 mm in 0,25 mm increments, the Tflex XS400 thermal material is naturally tacky for easy assembly and no adhesive coating is required. Due to its TG liner on the other side, it is electrically insulating, stable from -40°C to 160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.
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Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.
printer friendly version