The VIA EPIA-T700 from VIA Technologies is the first product based on the recently announced Mobile-ITX form factor.
Measuring a mere 6 x 6 cm, it is a computer-on-module (COM) that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.
The module can be used with a variety of carrier boards that can be adapted and customised to meet the needs of a range of applications and is powered by a specially miniaturised 1 GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer I/O flexibility in the most compact of available form factors. The board features 512 MB of DDR2 onboard system memory. The VIA VX820 media system processor adds key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio.
An integrated multiconfiguration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is provided through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA. The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5 G, making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Eskom announces PV registration extension
Computer/Embedded Technology
The South African Photovoltaic Industry Association has welcomed Eskom’s decision to extend its zero-registration fee policy and free smart meter installation for residential Small-Scale Embedded Generation customers until March 2026.
Read more...Unlock enhanced wireless performance
Computer/Embedded Technology
Duxbury Networking has introduced Cambium Networks’ Deep Virtual Circuit (Deep VC) technology, a free upgrade for the PMP 450 platform that will transform wireless broadband performance across the country.
Read more...Computing in industrial environments Vepac Electronics
Computer/Embedded Technology
The Panasonic Toughbook CF-33/CF33 Tablet is a 12,0-inch fully rugged device with hot-swappable twin batteries and highly configurable capabilities.
Read more...DDR5 DRAM series Vepac Electronics
Computer/Embedded Technology
Innodisk has announced its DDR5 6400 DRAM series featuring the industry’s largest 64GB single-module capacity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version