With new backplane and subrack demonstrators, ERNI Electronics is providing a solution for systems requiring increasing performance coupled with ongoing miniaturisation.
Using the two-row SMC connectors in a 1,27 mm pitch and the 1,0 mm MicroSpeed connectors, it is possible to implement highly compact, modular systems with high data rates. This allows highly sophisticated and custom-tailored system solutions to be realised.
Many users and customers are concerned with card-edge connector solutions and are seeking alternatives that are more reliable. After all, it is not possible to reliably employ edge-socket connectors in harsh environments exposed to severe vibrations and shock loads. Fretting corrosion can also occur, with inadequately designed and manufactured contacts wearing through due to vibration. By contrast, SMC and MicroSpeed are reliable connector systems, which, with dual-leaf contacts, ensure good contact wipe length and secure mating, whilst also satisfying demanding requirements thanks to their high-quality contact surfaces. The trend is towards proprietary solutions that are optimised with regard to their specific requirements. It is precisely here that the concept of the mini backplanes comes into play – offering high performance coupled with minimum space requirements and a high degree of reliability.
SMC connectors with 1,27 mm pitch have been deployed successfully in the market for about 20 years and have been consistently further developed. These connectors are frequently used in a number of locations within a system, be this for mezzanine, ribbon cable or coplanar configurations. Unshielded SMC connectors for applications without special high-speed requirements have been utilised in high volumes in applications such as programmable logic controllers. Furthermore, SMC connectors are also available in highly reliable pressfit technology, which makes them well suited for passive backplanes.
For more demanding applications, the MicroSpeed high-speed connectors in a 1,0 mm pitch along with their corresponding power modules are the preferred choice. Using these also makes it possible to address serial high-speed interconnects such as PCI Express 1/2/3, Rapid IO, SATA 1 and 2, Fibre Channel, USB3 and 10 Gigabit Ethernet (10GBASE-T or KR). As shielded connectors, the MicroSpeed components are also suitable for applications with EMC-open housings or particularly demanding requirements in terms of EMC performance.
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, Editor's Choice, Interconnection
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