Mentor Graphics has débuted innovative capabilities in the next generation of its FloTHERM 3D computational fluid dynamics (CFD) software for electronics cooling applications.
The patent-pending technology in the FloTHERM software provides bottleneck (Bn) and shortcut (Sc) fields so that engineers can identify where heat flow congestion occurs in the electronic design and why. It also identifies thermal shortcuts to quickly and efficiently resolve the design problem. Together, the Bn and the Sc fields elevate the use of simulation from an observation tool which identifies heat management problems to an effective thermal design problem-solving tool which suggests potential solutions to the designer.
Two additional enhancements have been made in the new FloTHERM v.9 product: XML model and geometry data importing to enable FloTHERM integration into existing data flows, and a direct interface to the Mentor Graphics Expedition PCB design platform. The direct interface enables users to import native Expedition PCB data, and delete or edit additional objects (heatsinks, thermal vias, board cutouts, EM cans) for more accurate thermal model design development.
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