ECD has released the PTP VP-8 thermal profiling kit for vapour phase soldering. As boards become more complex, with a range of high- and low-mass and lead-free passive and active components, vapour phase soldering is enjoying a strong comeback as a method of choice for high-reliability, complex and other expensive boards.
The PTP VP-8 is a complete thermal profiling solution, using the award winning M.O.L.E. MAP software, in combination with the German engineered PTP vapour phase profiler from globalPoint ICS. This combination provides all the power and analytics needed to both characterise and verify the key process parameters for complex, disparate or high-mass PCB assemblies. With a width of 90 mm, length of 100 mm and height of 50 mm, it provides a minimal form factor, important in minimising the drain on the vapour cloud and getting into tight spaces.
The kit includes the PTP VP-8 profiler with the PTP TX transmitter and PTP RX receiver, eight type-K thermocouples with mini connectors, along with USB connection cables and plug, M.O.L.E. MAP software and a carrying case.
The profiling kit is designed to eliminate wasted runs; first, by providing quick instrument status through the M.O.L.E. readiness indicators, showing core temperature and TC connectivity status, and second, by using eight channels of real-time data feed, which allows the operator to keep an eye on the critical data and abort a run if necessary. The lithium battery ensures quick charging and long life to withstand the rigors of vapour phase soldering.
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