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Reflow soldering oven
16 February 2011, Manufacturing / Production Technology, Hardware & Services
APS Novastar recently introduced the ERO-500 reflow soldering system to fill out the company’s mid-range product line. The cost-effective conveyor reflow oven has five vertical heating zones and one cooling zone, and has been developed for small- to medium-volume reflow soldering of SMT boards, hybrid boards and curing of glue or thick film pastes.
With a maximum system temperature of 320°C, reflow profiles can be optimised for lead-free and lead solder profiles. Each heating zone is independently programmable and controlled through the onboard LCD system controller. Optimising reflow profiles can be accomplished flexibly by defining conveyor speed, heating temperature, convection heat flow and cooling fans. Plenum convection heating technology provides uniform temperature profiling across the PCB board for enhanced SMT process control. Reflow profiling is capable with onboard programming and the ability to attach three thermocouples to the board. A data port is included for downloading of profile data and error logs. |
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Further reading:
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The system can accommodate conveniently packaged 50 ml side-by-side ...
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