Water soluble solder paste

16 February 2011 Manufacturing / Production Technology, Hardware & Services

Cobar ‘s Aquasol branded water-soluble solder paste can be used with any common soldering alloy.

SnPb and lead-free SAC and SN100C versions are available, all exhibiting excellent performance in the four key process steps: printing (including fine-pitch capability), placement, reflow and cleaning. Due to a balance between adhesive and cohesive forces, there is efficient separation from the squeegee and good aperture release with long stencil life.

The rosin nature of this water-soluble paste is unique, with paste rheology, solderability and water washability conferred by carefully selected surface chemistry and activators. With Aquasol branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the paste features excellent slump resistance and residues can be removed with de-ionised water.

The paste’s extended tack-time allows a long period between printing and placement. Additionally, the high tack force holds components in place during transportation prior to soldering. The paste minimises voiding in both air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionised water with or without cleaning agents. The ideal temperature and water pressure depend on the complexity of the assembly and efficiency of the wash method and equipment.

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