16 February 2011Manufacturing / Production Technology, Hardware & Services
DEK Solar recently launched its brand new photovoltaic (PV) metallisation platform at this year’s Solar Power International exhibition.
Eclipse is a very high throughput metallisation solution that features multiple print heads operating in parallel to eliminate downtime. Generating top print speeds of up to 600 mm/second, the platform features an innovative modular design concept, enabling manufacturers to easily scale production up or down, to 1200, 2400 or 3600 wph. Plus, if manufacturers foresee this kind of production ramp, the metallisation line can be designed accordingly, by inserting blank process modules equipped with conveyor belts where future production volumes will be added in. When the time is right for additional throughput volume, these blanks can be exchanged for extra print capacity, eliminating the need to reconfigure the entire line. Primary process modules, including the print head, incorporate master controls, meaning that subsequent, field-retrofittable modules operate as secondary ‘slaves’, removing the cost of further control units.
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Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
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The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
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There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
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The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
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Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
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To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
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