FTDI announced the launch of VNCLO-START1 – a development kit for the Vinculum-II (VNC2) USB host/device controller. This development platform combines the Vinculo motherboard with the VNC2 debug/programming module.
The Vinculum-II supports dual USB host/device interfaces, FIFO, SPI, I²C, PWM and UART. Onboard is a 10-bit, 8-channel ADC and 38 general-purpose I/Os which are available for quick prototyping. The kit features a free software development suite including a full featured C compiler, real-time operating system, and USB host/device software stack for HID, CDC, HUB, printer and BOMS (FAT file system).
Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...New Studio 6 SDK
Design Automation
New Simplicity Studio 6 SDK opens development environment, and opens developers to Series 3.
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he HYPB series from Hammond is a hygienic type 4X stainless steel pushbutton enclosure designed for use in environments where regular high temperature, high-pressure washdowns are required.
Read more...SMD varistors with huge surge current capability Electrocomp
Power Electronics / Power Management
TDK Corporation has introduced two new varistor series in SMD design, the larger of the two capable of handling a surge current of 10 000 A.
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Passive Components
With an operating temperature range of -55 to 125°C, with voltage derating, these capacitors have been designed especially for avionics and aerospace applications.
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Analogue, Mixed Signal, LSI
The NJU9103 AFE from Nisshinbo is a tiny analogue front end, with a 16-bit resolution ADC and up to 512 x signal amplification from the programmable gain amplifier.
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Passive Components
Panasonic Industries’ SMT capacitor series all benefit from the longest lifetime plus the lowest ESR values currently available.
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Passive Components
TDK Corporation has expanded its family of flat wire inductors with the high-performance EPCOS ERUC23 coupled inductor series.
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Enclosures, Racks, Cabinets & Panel Products
The design offers better impact resistance, and all sizes have the additional feature of shelves moulded into the base, fitted with threaded inserts to house a PCB or other electrical equipment.
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Telecoms, Datacoms, Wireless, IoT
InvenSense’s SmartSonic family of ultrasonic ToF sensors integrate a MEMS piezoelectric micromachined ultrasonic transducer with an ultra-low power SoC in a miniature reflowable package.
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