NPL defect of the month

8 June 2011 News

Featured from the NPLs defect database (http://defectsdatabase.npl.co.uk) this month is the issue of delamination on the surface of a board assembly.

The accompanying microsection image shows a plated through-hole with through-hole pin after soldering in a tin/lead process. Prior to sectioning, the board showed evidence of minor delamination and measling around the pad area on the subsurface of the board. The board was being produced in medium volume for a consumer product.

During pin insertion, mechanical strain or damage may be caused. The soldering temperature or the time to solder may have been excessive, causing expansion of the board. The photo is not very clear but based on the examination and comparison of the relative dimensions, the plating in the hole is thin and probably less than 20 μm. There is evidence of delamination/separation of the glass bundles at the hole/copper interface. Close examination of the microsection will be required along with the rest of the board for root cause analysis. There are a number of possible causes; along with board examination, all the process details would be required, or an audit of the assembly/soldering operation.

Visit www.dataweek.co.za/video for a video discussion on the terminology used to describe various restrictions on materials used in the manufacture of electronic products.

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