News


Touch sensing dev kit

8 June 2011 News

Dataweek is offering readers the chance to win a Microchip capacitive touch development kit.

Projected capacitive touch sensing extends resistive and existing capacitive touch sensing technology to include multi-touch and gesture sensing, enabling users to implement robust glass-front user interfaces that simplify user interaction. Typical applications include global positioning systems, thermostats, mobile handheld units and other devices that use smaller displays with a finger input.

The mTouch Projected Capacitive Development Kit (DM160211) provides a fully functioning projected capacitive touch system. The kit is also a sophisticated development platform to facilitate implementation of projected capacitive touch screen user interfaces. Preprogrammed firmware provided with this kit supports multitouch with sensors ranging from 1x1 to 13x11 XY electrode patterns. The source code is available royalty-free from www.microchip.com/mtouch for use on Microchip PIC MCUs.

The kit includes a 3,5” sensor mounted on a sensor board, a projected capacitive board with the PIC16F707 MCU and fully functional firmware. The PIC16F707 features two 16-channel capacitive sensing modules (CSMs) that can run in parallel for increased sampling speed, and operates from a wide input voltage range of 1,8–5,5 V, with a typical projected capacitive sensor application operating current of 1,5 mA at 5 V. The open source code supports sensors with up to 32 channels and the kit includes a graphical user interface tool that enables easy parameter adjustment.

For your chance to win one of these development kits, visit www.microchip-comps.com/dw-procap and complete the online entry form.

Competition entries close 30 June 2011.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved