NPL defect of the month
6 July 2011
News
Manufacturing / Production Technology, Hardware & Services
The accompanying optical image from NPL’s manufacturing defect database (http://defectsdatabase.npl.co.uk) shows a flip chip component reflowed to a standard laminate printed board in a lead-free process. A question was raised over one of the joints on the far left and the fibre contamination. The component was X-rayed and the solder joints were found to be satisfactory.
Small fibres like the one seen are not uncommon on the surface of printed boards. They can be airborne contaminants held in place by the flux applied prior to flip chip placement. Random in-process inspection of boards prior to component placement and inspection of bare boards for cleanliness could be considered in similar cases.
A video, located at www.dataweek.co.za/video, discusses solder joint problems encountered during intrusive reflow.
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