DSP, Micros & Memory


MCU for multimedia systems

20 July 2011 DSP, Micros & Memory

STMicroelectronics introduced a new embedded microprocessor with advanced multimedia capabilities. The latest addition to the dual-core ARM Cortex-A9 microprocessor family, the SPEAr1340 targets smart connected devices, from high-resolution video conferencing to intelligent displays and web-connected devices.

The device integrates a powerful ARM Mali 200 graphics processing unit for advanced 2D and 3D acceleration in user interfaces, navigation systems, browsing and gaming. It also embeds a hardware video encoder and a decoder supporting popular compression standards (including H.264, AVS and VP8), with video resolution up to 1080p and 30 frames per second. The SPEAr1340 can also handle multiple concurrent video flows (four camera inputs available) in multimedia-intensive applications like surveillance video cameras.

Hardware implementation of graphics and video capabilities results in state-of-the art multimedia performance at low power consumption, while maintaining the two Cortex-A9 cores available for performing concurrent tasks as requested by the user. With its multiple interfaces, including I²S and S/PDIF, the SPEAr1340 also provides excellent audio capabilities, handling up to 7.1 surround sound configurations in both input and output paths.

As for security, the chip integrates a multistandard cryptographic engine and one time programmable (OTP) registers for unique identification and external Flash memory anti-tamper protection.

The dual ARM Cortex-A9 processors support both fully symmetric and asymmetric operations, at speeds of 600 MHz/core (industrial worst-case conditions) for 3000 DMIPS equivalent. Network-on-chip is a flexible communications architecture providing Quality of Service (QoS) for the whole system as it enables multiple different traffic profiles while maximising data throughput.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved