NPL defect of the month

3 August 2011 Manufacturing / Production Technology, Hardware & Services

This month we feature a recent issue submitted to the NPL defect database http://defectsdatabase.npl.co.uk of a BGA solder short. Or is it?

The accompanying optical inspection image of the BGA joints in question shows connection between two balls after rework and repair. This, in fact, is probably not a solder short, but is more likely to be a flux short. During inspection one can still see light through the material between the two balls. This is most probably caused by excessive amounts of flux or incorrect material being used on the rework process.

This was conducted in a lead-free process, on a telecommunications product in medium volume. Being a lead-free process, the higher process temperature may have contributed to the discolouration/darkening of the flux used. To confirm that this is only a flux short and nothing else, X-ray inspection should be used. With this volume of flux, cleaning may only make inspection more difficult. If X-ray shows the solder joints to be satisfactory and electrical testing provides a positive report, the BGA should be left in place. A review of the rework process should be conducted to confirm the procedures, rework training and the materials used.

August’s featured NPL defect video covers the causes of solder fillet lifting – watch it at www.dataweek.co.za/video

Further reading:

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