NPL defect of the month
14 September 2011
News
Manufacturing / Production Technology, Hardware & Services
The NPL defect database (http://defectsdatabase.npl.co.uk) this month features the accompanying microsection image showing an open connection between the through-hole copper plating and the inner layer tracking.
The microsection has been poorly prepared with potential damage to the plating during grinding. As can be seen, there is no resin in the hole to support the through-hole copper plating. The surface of the copper is rounded so one would not be able, in this example, to prove the root cause of the problem.
It is accepted that the sample has been poorly prepared – any time a section is being prepared, it is important that resin enters the through-hole. In the case of via holes, they may be coated with solder mask; in this case the mask surface must be broken to allow resin to enter the hole. If a section is found to not have resin in it prior to grinding to the centre, it is important to stop grinding. This allows the hole to be filled with resin, recurred prior to further grinding of the sample.
In an issue unrelated to the above, to gain insight into the causes and tests for solder beading, visit www.dataweek.co.za/video to watch an informative video.
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