NPL defect of the month

14 September 2011 News Manufacturing / Production Technology, Hardware & Services

The NPL defect database (http://defectsdatabase.npl.co.uk) this month features the accompanying microsection image showing an open connection between the through-hole copper plating and the inner layer tracking.

The microsection has been poorly prepared with potential damage to the plating during grinding. As can be seen, there is no resin in the hole to support the through-hole copper plating. The surface of the copper is rounded so one would not be able, in this example, to prove the root cause of the problem.

It is accepted that the sample has been poorly prepared – any time a section is being prepared, it is important that resin enters the through-hole. In the case of via holes, they may be coated with solder mask; in this case the mask surface must be broken to allow resin to enter the hole. If a section is found to not have resin in it prior to grinding to the centre, it is important to stop grinding. This allows the hole to be filled with resin, recurred prior to further grinding of the sample.

In an issue unrelated to the above, to gain insight into the causes and tests for solder beading, visit www.dataweek.co.za/video to watch an informative video.

Further reading:

From the editor's desk: Exciting times ahead?
Technews Publishing News
There are many subjects that excite me in this world, but two of the larger technical subjects are, firstly, renewable energy, and secondly, the idea of artificial intelligence as it continues to evolve ...

Read more...

---

Microchip expands partnership with TSMC
News
Microchip Technology has announced it has expanded its partnership with TSMC to enable a specialised 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing.

Read more...

---

Huge SA grid battery project
News
A standalone battery energy storage system (BESS) has won preferred bidder status under South Africa’s Energy Storage Capacity Independent Power Producer Procurement Programme (ESIPPPP).

Read more...

---

Mouser sponsors NCP Cup 2024
News
The NXP Cup is an EMEA-based autonomous car competition, presented by NXP Semiconductors, which is designed to provide students with real-world experiences in autonomous vehicle programming and building.

Read more...

---

TrinaTracker brings its smart solar tracking to SA
News
The Vanguard 1P is designed to provide customers with trackers that combine suitability for flat terrain, together with outstanding system stability and reliability, quick installation, and flexible external compatibility.

Read more...

---

Nordex adding 830 MW of wind generation
News
Nordex Energy South Africa will be adding 830 MW of wind energy generation capacity to the company’s already-installed 1 GW base.

Read more...

---

Invertek produces its three millionth drive
iTek Drives News
Invertek Drives Ltd, a global manufacturer of variable frequency drive (VFD) technology, has celebrated producing its three millionth VFD, just three years after its two-million milestone.

Read more...

---

Analog Devices’ digital storefront is live
News
Analog Devices has designed an improved digital experience with users in mind – a new analog.com website and eShop.

Read more...

---

Vicor Powering Innovation podcast
News
The episode explores electrification with Lightning Motorcycles, a company that produces the fastest electric motorcycle on the planet.

Read more...

---

ModusToolbox Workshop 3
News
This workshop will focus on enabling a PSoC development kit, connected over Wi-Fi and leveraging MQTT, to create the framework of an IoT application.

Read more...

---