NPL defect of the month

12 October 2011 Manufacturing / Production Technology, Hardware & Services News

Taken from the NPL defect database (http://defectsdatabase.npl.co.uk), the accompanying image shows a side view of solder joints on an LGA/QFN package. Between the terminations, evidence of flux residues is visible and would be common on a standard assembly process. Flux residues are also visible under the package.

Looking closely at these flux residues, it is apparent that the process of cleaning has not been correctly or completely reviewed. The residues look to have been through a cleaning process and are not being dissolved or are insoluble due to poor process compatibility. A proper evaluation of the process, paste, cleaning system and chemistry needs to be conducted to confirm the residues are compatible and the cleaning system is capable of cleaning the component stand-off height on this LGA QFN package. Normally the standoff height of these packages is below 0,004”; the example shown had a standoff height of 0,008”.

In October’s featured NPL defect video (accessible at www.dataweek.co.za/video), industry expert Bob Willis discusses the causes and tests for outgassing on through-hole leads.

Further reading:

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