12 October 2011Manufacturing / Production Technology, Hardware & Services
NXG33 lead-free, halogen-free no-clean solder paste is the latest state-of-the-art material from Kester. Bringing together halogen-free chemistry, excellent printing and robust solderability performance, it is suitable for modern assembly challenges.
Available with a standard Type 4 powder, NXG33 is capable of a wide range of printing challenges. It meets the halogen-free definition per IPC requirements of 900 ppm Br/900 ppm Cl/1500 ppm combined. The material is capable of supporting 8 x 8 mil deposits and other fine-feature apertures sizes, including 01005 components. Excellent anti-slump behaviour mitigates bridging issues.
NXG33 offers light-coloured post-soldering residues, even with reflow temperatures at the upper edge of the profile window. It therefore offers excellent residue appearance and penetrability to ease AOI and manual inspection.
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printer friendly version