Interconnection


High-density interconnects

9 November 2011 Interconnection

Samtec is continuing to evolve its line of SEARAY open pin field interconnects to support the demands of high-speed applications requiring highly reliable, high pin count solutions.

The latest additions to the family are a right angle design ideal for perpendicular and high-speed micro backplane applications, and a press-fit design that combines the flexibility and convenience of press-fit tails with enhanced signal integrity and mechanical performance. Both designs use a 1,27 x 1,27 mm grid array to achieve grounding and routing flexibility, and feature Samtec’s robust, signal integrity-optimised Edge Rate contact system.

Right angle SEARAY terminals and sockets (SEAM-RA/SEAF-RA series) are optimised to reduce skew and impedance mismatch and have low insertion and extraction forces. Terminals and sockets are available in 4-, 6-, 8- or 10-row configurations with up to 500 I/Os. Right angle arrays mate with SEARAY surface mount (SEAM/SEAF series) and right angle (SEAM-RA/SEAF-RA) sockets and terminals and with SEARAY high-density flex data links (SADL series) and high-speed Twinax cables (SEAC series). Optional guide posts and latching posts are available for rugged applications and allow for blind mating.

Press-fit SEARAY terminals (SEAMP series) are also available in 4-, 6-, 8- or 10-row configurations offering up to 500 I/Os. The terminals mate with a choice of SEARAY interfaces: surface mount sockets (SEAF series) in three standard stack heights, high-density flex data links (SADL series) for cable-to-board applications, or the new right angle sockets (SEAF-RA series) for multilayer PCB designs such as high-speed micro backplane applications. Additional pin counts, plating options and guide posts, as well as the required application tooling, are also available.

Samtec also recently introduced a new 0,8 mm micro pitch version of its SEARAY high-density interconnects (SEAM8/SEAF8 series) offering high-speed performance and the grounding and routing flexibility of the 1,27 mm pitch arrays, while requiring half the board space.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033, [email protected], www.otto.co.za



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