For those looking to get a handle on commonly used electronics industry acronyms and terminology, IPC has released IPC-T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The J revision contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
The terms and definitions within the standard are written to provide clarity of detail, so that a reader utilising English as a second language can understand the subtleties of the meaning of each term. The latest revision takes the mystery out of haloing, head on pillow, mouse bites, pad cratering, moisture/reflow sensitivity classification and other terms.
Read more...Electronic News Digest
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A brief synopsis of current global news relating to the electronic engineering fields with regards to company finances, general company news, and engineering technologies.
Read more...Correction: Marijana Abt, Rebound Electronics
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In the August issue of Dataweek magazine, the article titled ‘Celebrating innovation, leadership, and the next generation’ featured Marijana Abt, senior account manager at Rebound Electronics. Owing ...
Read more...Trasna and RF Design announce distribution agreement RF Design
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Trasna and RF Design have announced a strategic distribution agreement for cellular IoT solutions which will ensure seamless availability of Trasna’s cellular connectivity solutions.
Read more...Comtest hosts channel partners Comtest
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Comtest, together with FLUKE, recently set the stage for an unforgettable afternoon as they welcomed over 80 Channel Partners to their annual celebration of excellence.
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