Samtec’s newly released High Density One Piece Interface, integrated with Plastronics’ spring-loaded H-Pin contact, is designed with excellent electrical, mechanical and thermal features. This interface is a low-cost, space-saving alternative to other spring-loaded contacts and pin and socket systems that does not sacrifice high-speed performance and maintains a reliable connection.
Samtec’s 1 mm SCA series features a low-profile 3,60 mm stack height and is available in four or eight rows with up to 320 total spring-loaded contacts that will rotate in the body of the interface. The spring-loaded H-Pin contact features a low-cost stamped construction with machined pogo pin performance capable of 5000+ spring cycles.
The H-Pin contact has a total pin deflection of up to 0,7 mm and a flat spring rate for stable initial contact resistance of 28 m. The large deflection provides compliancy for large package warpage. The pin is constructed of beryllium copper for solid electrical performance and a stainless steel core spring designed for high-temperature compliance.
This interface provides a current carrying capacity of 1,1 A per contact at 30°C temperature rise with eight pins powered. In addition, dual alignment pins on top and bottom are standard for alignment on the board.
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