Passive Components


Power inductors

18 April 2012 Passive Components

TDK-EPC has extended its portfolio of compact multilayer power inductors to include the TDK MLP1608-V series in size 1608. The miniaturised components are suited for use in the power supply circuitries of mobile devices such as smartphones, conventional mobile phones, digital cameras and similar products.

The new series augments the existing 2520, 2016 and 2012 series (2,5 x 2,0 mm, 2,0 x 1,6 mm, 2,0 x 1,2 mm) with a product that, with a footprint of 1,6 x 0,8 mm and an insertion height of as low as 0,75 mm, is even smaller. This miniaturisation was made possible thanks to a low-loss ferrite material that was developed by applying proprietary materials technology.

When used in place of existing TDK MLP2012S components (1 μH) as a power inductor in the power supply circuitry, a volume reduction of more than 50% can be achieved without lowering the power conversion efficiency at currents of up to 100 mA.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Robust series of vertical-mating battery connectors
Electrocomp Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.

Read more...
Cutting-edge hybrid capacitors
Avnet Silica Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.

Read more...
Low-profile tantalum chip capacitors
Electrocomp Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.

Read more...
Compact high-performance antennas
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol 2,4 GHz antennas ideal for use in SiP applications.

Read more...
Coupled inductor for high-performance applications
Passive Components
This coil with MnZn core is characterised by its high permeability and extremely low RDC values, which achieves excellent power density and very high efficiency.

Read more...
Track with precision
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.

Read more...
RGBIR sensor with I2C interface
Electrocomp Opto-Electronics
Available in a miniature opaque 2,67 x 2,45 mm package, Vishay’s VEML6046X00 includes high-sensitivity photodiodes, a low noise amplifier, and a 16-bit analogue to digital converter.

Read more...
Power inductors
iCorp Technologies Passive Components
he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.

Read more...
SMT power inductors
Future Electronics Passive Components
The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved