Passive Components


Power inductors

18 April 2012 Passive Components

TDK-EPC has extended its portfolio of compact multilayer power inductors to include the TDK MLP1608-V series in size 1608. The miniaturised components are suited for use in the power supply circuitries of mobile devices such as smartphones, conventional mobile phones, digital cameras and similar products.

The new series augments the existing 2520, 2016 and 2012 series (2,5 x 2,0 mm, 2,0 x 1,6 mm, 2,0 x 1,2 mm) with a product that, with a footprint of 1,6 x 0,8 mm and an insertion height of as low as 0,75 mm, is even smaller. This miniaturisation was made possible thanks to a low-loss ferrite material that was developed by applying proprietary materials technology.

When used in place of existing TDK MLP2012S components (1 μH) as a power inductor in the power supply circuitry, a volume reduction of more than 50% can be achieved without lowering the power conversion efficiency at currents of up to 100 mA.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Harnessing Leakage Inductance
Würth Electronics South Africa Passive Components
Würth Electronics has expanded its WE-MCRI product series with the new 1090HL variant (HL = High Leakage), a coupled inductor specifically designed to improve the performance of SEPIC, ZETA and Cuk converters.

Read more...
Ultra-slim 30 W DIN Rail AC/DC
Brabek Passive Components
RECOM is extending its REFIN family with the new REFIN2U-S30.

Read more...
Panasonic thick film current sense resistors
Avnet Abacus Passive Components
Panasonic thick film current sense resistors enable potential cost savings up to 50% as an alternative to metal shunts

Read more...
Space saving SMD common-mode chokes
Electrocomp Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm

Read more...
Highly rugged GAPS and HAPS proximity sensors
IOT Electronics Passive Components
Now available through Powell Electronics are the GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors from Honeywell.

Read more...
Understanding EMI Filters and their applications
Vepac Electronics Passive Components
Electromagnetic Interference (EMI) Filters are essential for maintaining electromagnetic compatibility (EMC), allowing multiple devices to function together without interference.

Read more...
SMT flat-wire inductor
Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.

Read more...
Compact SSI family for industrial automation
Altron Arrow Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).

Read more...
SGMICRO expands analogue IC portfolio
iCorp Technologies Passive Components Telecoms, Datacoms, Wireless, IoT
SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.

Read more...
SMT flat-wire inductor for automotive electronics
Würth Electronics South Africa Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved