Passive Components


Power inductors

18 April 2012 Passive Components

TDK-EPC has extended its portfolio of compact multilayer power inductors to include the TDK MLP1608-V series in size 1608. The miniaturised components are suited for use in the power supply circuitries of mobile devices such as smartphones, conventional mobile phones, digital cameras and similar products.

The new series augments the existing 2520, 2016 and 2012 series (2,5 x 2,0 mm, 2,0 x 1,6 mm, 2,0 x 1,2 mm) with a product that, with a footprint of 1,6 x 0,8 mm and an insertion height of as low as 0,75 mm, is even smaller. This miniaturisation was made possible thanks to a low-loss ferrite material that was developed by applying proprietary materials technology.

When used in place of existing TDK MLP2012S components (1 μH) as a power inductor in the power supply circuitry, a volume reduction of more than 50% can be achieved without lowering the power conversion efficiency at currents of up to 100 mA.



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