Counterfeit component webinar
16 May 2012
News
Counterfeiting is a constant problem to all industry sectors; however solutions can now be simplified with training to IDEA 1010 and SAE standards, thanks to an upcoming webinar presented by Bob Willis. Understanding the problem and simple inspection procedures along with documented reference databases, can prevent unnecessary costs. Details of the next webinar, to be held in July, are available to view online at www.bobwillisonline.com/training_detail.asp?WorkshopID=68.
Practical testing of components is one of the most cost effective methods when parts are compared with a golden sample or other reference sources. However, using X-ray provides the best and most flexible technique at component level and for parts still sealed in their original unopened packaging.
Quality, purchasing, design and production engineers need to review the growing commercial and technical issues surrounding counterfeit electronic components. They can look right, solder to the PCB but just fail to function. A typical first assumption by test engineering is that it is a component failed due to the assembly process; but it is what is inside the package that counts, which is sometimes nothing at all.
Rather than making complicated copies of parts, the simplest thing for counterfeiters is to re-mark the packaging or the component body. Re-marking the packaging is simple and quick, and provided the component identification is not checked, all the parts would be placed and soldered to the board before the problem was identified. AOI should find incorrectly marked parts or variations on the parts but the level of sophistication in marking is now becoming very sophisticated.
The webinar will not only illustrate the problems raised by counterfeit components within the electronics industry but it will also show some of the different test methods that can be used to confirm the integrity of the components.
Further reading:
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