Manufacturing / Production Technology, Hardware & Services


PCB circuit materials

27 June 2012 Manufacturing / Production Technology, Hardware & Services

At the recent IEEE International Microwave Symposium, Rogers Corporation dèbuted the 2929 bondply system and low-loss RO4835 circuit laminate with enhanced oxidation resistance for long-term performance.

The 2929 bondply is an unreinforced hydrocarbon-based, thin-film adhesive system intended for use in high-performance, high-reliability, multi-layer circuit constructions. Its low dielectric constant (2,9) and low loss tangent (<0,003) at microwave frequencies make it ideal for bonding multi-layer circuit boards based on high-performance composite dielectric materials such as Rogers RT/duroid 6000, RO4000 and RO3000 series laminates.

The proprietary crosslinkable resin system makes this thin-film adhesive system compatible with sequential bond processing. The ability to manage flow of the adhesive system allows for significant blind via fill capability with potentially predictable cutback ratios for designs requiring blind cavities.

2929 bondply material is compatible with traditional flat press and autoclave bonding methods. It is currently available in 0,038, 0,051 and 0,076 mm sheet thicknesses; sheets can be stacked to yield thicker adhesive layers. The unreinforced thin-film can be tack bonded to inner layers to simplify simultaneous machining of cutouts through core and adhesive layers. A carrier film protects the adhesive layer from contamination during machining and multi-layer-board booking processes.

The new RO4835 high-frequency laminate is specially formulated with improved oxidation resistance, and was developed for applications needing a special level of electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. It offers a dielectric constant of 3,48 at 10 GHz and low loss tangent of 0,0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions.

These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper, for excellent dimensional stability. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard methods.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

20 years of precision, progress and purpose – the Jemstech journey
Jemstech Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.

Read more...
An argument to redefine IPC class definitions for class 1, 2, & 3 electronics
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.

Read more...
Large platform stencil printer
Techmet Manufacturing / Production Technology, Hardware & Services
GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.

Read more...
Press-fit component inspection
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.

Read more...
A new era in wire bond inspection
Techmet Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.

Read more...
High-speed, high-resolution material deposition system
Manufacturing / Production Technology, Hardware & Services
ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025.

Read more...
Mycronic’s MYPro A40 pick-and-place solution
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
Mycronic’s MYPro A40 pick-and-place solution, equipped with an MX7 high-speed mounthead technology, increases top placement speeds by 48% over the previous generation.

Read more...
Why ergonomics matters in digital microscopy
TANDM Manufacturing / Production Technology, Hardware & Services
While magnification technology has kept pace with demand, the wellbeing of the people behind the microscopes has often been overlooked with technicians spending long hours in intense focus, leading to chronic strain, fatigue, and costly mistakes.

Read more...
Multiprotocol wireless SoC
RF Design Telecoms, Datacoms, Wireless, IoT
The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.

Read more...
From ER to effortless: The 15-year journey of Seven Labs Technology
Seven Labs Technology Manufacturing / Production Technology, Hardware & Services
What started as a business likened to an ‘ER’ for electronic components has today grown into a trusted partner delivering kitting services and full turnkey solutions – taking the effort out of electronics and helping customers truly ‘Move to Effortless.’

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved