New power semiconductor package

18 July 2001 Power Electronics / Power Management

Ixys offers a new package for power semiconductors. The very flat ECO-PAC package (at 9 mm high) enables compact design and economical system solutions to be developed. It offers a wide choice of circuit configurations of diode, thyristor and MOSFET, IGBT, Schottky-diodes and FRED chips within a single package, thereby reducing the number of external connections.

This package design provides isolation voltages of over 3600 V a.c. RMS, allows optimum heat transfer direct to the heatsink and is suitable for soldering on to PCBs. The use of DCB technology and planar glass-passivated silicon-diffused chips in ECO-PAC leads to superior long-term reliability and thermal/load cycling capability.

ECO-PAC is offered up to 1600 V and to 175 A RMS and can easily replace up to six discrete devices.

Avnet Kopp, (011) 444 2333

[email protected]

www.avnet.co.za

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