Diplexers for several wireless standards

10 July 2013 Passive Components

AVX has introduced a new series of low-profile 0805 MLO diplexers based on its patented multilayer organic high-density interconnect technology.

The new parts incorporate high-dielectric-constant and low-loss materials to realise high-Q printed passive elements, such as inductors and capacitors in multilayer stack-ups.

Featuring low insertion losses, low parasitics, a low profile (<0,6 mm) and excellent solderability, the new 0805 Series diplexers support several wireless standards, including WCDMA, CDMA, WLAN and GSM, and are ideally suited for band switching in dual- and multi-band systems.

The diplexers measure 2,12 x 1,28 x 0,55 mm, are rated for use in temperatures ranging from -40°C to +85°C, feature a maximum power capacity of 4,5 W, and are expansion matched to most PCB materials.

Available in four frequencies and two terminations (Au and Ni/Sn), both of which are compatible with automatic soldering technologies, the components feature standard tape-and-reel packaging and are 100% tested for electrical parameters and visual characteristics.

For more information contact Yolandi de Beer, Avnet Kopp, +27 (0)11 319 8600, [email protected], www.avnet.co.za

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