Heatsink attachment system

7 August 2013 Manufacturing / Production Technology, Hardware & Services

Advanced Thermal Solutions has added to its line of maxiGRIP attachment systems for fast, secure mounting of heatsinks to flip chips, BGAs and other hot PCB components. More than 200 variations of maxiGRIP are now available for use on a wide range of IC brands and packages.

The system features a plastic frame clip that snaps securely around a component’s perimeter. A stainless steel spring clip runs through the heatsink’s fin field and fastens securely to the plastic frame. As a result, the sink is mounted securely to the component with steady, even pressure. The spring clip is easily removed to allow a heatsink to be detached and re-attached. The frame clip is also removable.

maxiGRIP provides strong, reliable attachment of heatsinks on vertically-mounted components and on devices exposed to shock and vibration. The assembled system is very low in profile, allowing use in restricted spaces. Unlike alternative screw-on or snap-on attachment systems there is no chance of over- or under-tightening the sink to the processor surface or having the heatsink pop out during transport or installation, or by shock and vibration.

For more information visit www.qats.com

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