Schottky diode with high power density

7 August 2013 Power Electronics / Power Management

With the introduction of its first wafer level chip scale packaged (WLCSP) Schottky, Diodes Incorporated is providing an alternative to miniature DFN0603 devices that offers twice the power density for the same PCB footprint.

In the X3-WLCUS0603-3 solder pad package, the 30 V, 0,2 A SDM0230CSP has a typical thermal resistance of just 261°C/W. This is around half that of the DFN0603 package so power dissipation is doubled in switching, reverse-blocking and rectification circuits.

Utilising 70% less board space than the industry-standard DFN1006 and SOD923 packaged options, the 0,18 mm² footprint device is also well suited to high-density design. Additionally, its 0,3 mm off-board profile is 25% thinner, benefiting ultra-thin portable products.

The Schottky’s low maximum forward voltage of just 0,5 V for a forward current of 0,2 A, combined with a typical low leakage current of only 1,5 mA at a reverse voltage of 30 V, means it minimises power losses, thus extending battery life.

For more information contact Erich Nast, Avnet Kopp, +27 (0)11 319 8600, [email protected], www.avnet.co.za

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