Easy access wall enclosures
29 August 2001
Manufacturing / Production Technology, Hardware & Services
OKW has developed its new multiTEC series of aluminium wall cases. These enclosures are designed for indoor applications such as door entry systems, security alarms, machine or process controllers, detection systems etc. The multiTEC design incorporates some unique features, such as an integrated rear panel/wall-mounting plate, which allows the engineer complete access to both the front and rear of the unit during installation and servicing.
The case body is pre-assembled and painted light grey RAL 7035, it also includes a recessed area for cable glands. The folded rear panel includes keyholes for wall mounting and locates snugly into the rear of the case body. Copper contacts are also provided to ensure good connection between the components.
There are two optional front panel kits: 'front fixing' for general purpose applications and 'rear fixing' for fitting membrane keypads.
Four sizes are available: 150x150x65 mm, 250x150x65 mm, 250x250x100 mm and 350x250x100 mm. Accessories include panel mounting frames, which allow the cases to be fitted flush into a control panel, bulkhead or floor box. These enclosures can be customised to suit the customer's components. Options include: machining holes and cutouts for connectors, switches etc, as well as silk-screen printing and painting in other colours.
Avnet Kopp
(011) 444 2333
[email protected]
www.avnet.co.za
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...