29 August 2001Manufacturing / Production Technology, Hardware & Services
The Erni KSG200 cable connector housing is intended for use with the TMC series D-Sub connectors to DIN 41612, MIL-C-24308 and IEC 807-3. It was designed to comply with high ESD requirements and provide shielding against EMI/RFI.
The connector housing and knurled screw heads are made of high performance plastic and satisfy IEC 801-2 requirements. Operating temperature range is -65 to 185°C. To improve shielding, two shielding plates are riveted to the housing half-shells. The shielding plates have a special design which allows a very high level of shield attenuation. At 100 MHz more than -66 dB and at 500 MHz better than -55 dB (comparison values for metallised housings are approximately -55 and -45 dB respectively).
The lamellar indents of the shielding plates at the contact points to the TMC connector and to the strain relief makes a major contribution to this very high shielding level. The strain relief also connects the cable's braided shield to the shielding plates (cables up to 11 mm diameter may be used).
Assembly is fast by means of snap latches on the two half-shells. Fixing screw/s prevent the half-shells from separating. Four housings in sizes 9, 15, 25, and 37 pins are available.
Smart RFID labelling
Manufacturing / Production Technology, Hardware & Services
Brady’s ‘RFID Labels/Smart Labelling’ offering positions itself as a turnkey way to attach a digitally-enabled identity to physical assets.
Read more...Generative AOI programming MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
Mycronic’s PCB Assembly Solution division has announced the launch of GenI, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection programming.
Read more...Clearing the Static: The importance of cleaning in ESD control Actum
Circuit & System Protection
To prevent Electrostatic Discharge (ESD) damage to sensitive electronic assemblies and components, all production, handling, packaging, and storage must take place in an ESD-protected environment.
Read more...AI-based visual inspection system ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
As industries embrace the era of smart automation, Siemens has introduced a groundbreaking innovation – the Inspekto AI-based visual inspection system.
Read more...Transparent rigid PCBs launched on PCBWay PCBWay
Manufacturing / Production Technology, Hardware & Services
[Sponsored] PCBWay is thrilled to announce a highly anticipated new service - transparent rigid PCBs – a combination of technology and aesthetics.
Read more...20 years of precision, progress and purpose – the Jemstech journey Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...An argument to redefine IPC class definitions for class 1, 2, & 3 electronics MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...Large platform stencil printer Techmet
Manufacturing / Production Technology, Hardware & Services
GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...Press-fit component inspection MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...A new era in wire bond inspection Techmet
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version