Texas Instruments has introduced a smart bypass diode in a standard surface-mount package with 15 A current handling capability and very low power dissipation. In a typical application, each SM74611 lowers power dissipation by 80% and reduces the operating temperature inside the junction box by 50°C when compared with a similar box using three conventional Schottky diodes.
When a photovoltaic (PV) solar panel is shaded, the active diode provides an alternate low-resistance path for string current to prevent hot spots that can damage the panel. The device protects the panel and improves panel reliability by boosting efficiency, and the reduced thermal dissipation enables more compact junction boxes with smaller heatsinks.
The SM74611 is offered in a two-terminal D2PAK package that measures 10,2 by 9 by 4,5 mm.
Clearing the Static: Effectively control static in your workplace Actum Electronics
Circuit & System Protection
Controlling electrostatic discharge in the workplace is crucial to protect sensitive electronic equipment from damage. Implementing an ESD control program involves various measures and tests.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.