Texas Instruments announced the availability of its Multicore Software Development Kit (MCSDK) on the low-power OMAP-L138 and OMAP-L132 DSP + ARM9 processors, offering developers reduced development time and scalability to TI’s TMS320C6000 high-performance digital signal processors (DSPs).
Customers developing applications for industrial, communications, telecom and medical markets can now migrate to high-performance devices without moving to another software platform.
MCSDK provides highly optimised bundles of foundational, platform-specific drivers to enable development on TI’s devices. Providing well-defined application programming interfaces for ease of programming, it supports future portability to higher performance TI multicore platforms so that customers do not have to develop common layers from scratch.
The kit gives developers the ability to evaluate hardware and software capabilities of the device-specific development platforms and to rapidly develop multicore applications. In addition, it enables applications to use SYS/BIOS and/or Linux on one platform.
Typically the MCSDK individual cores can be assigned to operate Linux applications as a control plane, while other cores are simultaneously assigned high-performance signal processing operations. This heterogeneous configuration provides software developers the flexibility to implement full solutions on TI’s multicore processors.
In the case of the OMAP-L138, the internal ARM9 processor can be assigned with a high-level operating system, such as embedded Linux, performing complex I/O stack handling, while the TMS320C647x DSP runs TI RTOS (previously SYS/BIOS) real-time processing tasks.
The MCSDK contains libraries that are compatible with TI’s C647x DSPs and KeyStone-based DSPs including the C665x, C667x, 66AK2Hx and 66AK2Ex processors. With the MCSDK, developers are able to access and benefit from various optimised DSP libraries including the math library, digital signal processing library, image and video processing library, telecom libraries and speech and video codecs.
In addition, the OMAP-L138 processor is packed with a combination of application-tuned features and peripherals including Ethernet, USB, SATA, Video Port Interface (VPIF), uPP and more.
Enhanced graphics on STM32U3
Design Automation
ST has introduced a new program designed specifically for users working with its mainstream STM32 MCUs, including STM32C0, U0, WBA, and U3 series.
Read more...Versatile range of camera modules EBV Electrolink
Opto-Electronics
The CAM-66GY pro-modules from ST are a full range of sample camera modules made for a seamless evaluation and integration of the VD66GY 1,5-megapixel colour image sensor.
Read more...Elevate your motor control designs EBV Electrolink
DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.
Read more...Siemens unveils groundbreaking Tessent AnalogTest software ASIC Design Services
Design Automation
Siemens Digital Industries Software recently introduced Tessent AnalogTest software - an innovative solution that reduces pattern generation time for analogue circuit tests from months to days.
Read more...MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...STM32Cube MCU package for STM32WBA
Design Automation
The STM32CubeWBA utility gathers in one single package all generic embedded software components required to develop an application on STM32WBA series microcontrollers.
Read more...Why LabVIEW is critical to South Africa’s automation future
Design Automation
[Sponsored] In a world increasingly defined by connected systems, edge intelligence, and accelerating automation, the ability to build scalable, responsive, and maintainable engineering applications has never been more essential, and at the heart of this evolution lies LabVIEW.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Take analogue designs from idea to reality
Design Automation
Bringing your analogue design ideas to life is simple with Microchip’s Analog Development Tool Ecosystem, part of its extensive range of solutions for both analogue and digital engineers.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version