19 February 2014Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has launched COOLSPAN thermally and electrically conductive adhesive (TECA) film providing reliable high-temperature performance. It is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heatsink coins and RF module housings.
The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical or press fit metal attachment. It provides both a thermally and electrically conductive bond interface. The film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
The material is able to survive lead-free solder processing and offers high chemical resistance and high temperature performance. It has been demonstrated to easily survive 5x lead-free solder exposures, 1000 hours at 85°C/85%RH, and 190°C for 10 days.
Wi-Fi 7 front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.
Read more...Find high-quality flex and rigid-flex PCBs at PCBWay PCBWay
Manufacturing / Production Technology, Hardware & Services
[Sponsored] Flex and rigid-flex PCBs are widely used across various industries due to their unique combination of flexibility, durability, and design versatility. Among the leading providers, PCBWay stands out for its exceptional quality services.
Read more...GNSS chipset for wearables RF Design
Telecoms, Datacoms, Wireless, IoT
The UBX-M10150-CC from u-blox is a GNSS chip that supports GPS, QZSS/SBAS, Galileo, and BeiDou constellations, and is designed for integration into wearable applications.
Read more...The ultimate range for design and repair RS South Africa
Manufacturing / Production Technology, Hardware & Services
Whether adapting existing systems or maintaining essential equipment, design and repair play a crucial role in ensuring efficiency and longevity.
Read more...Next-generation SPI and AOI series Techmet
Manufacturing / Production Technology, Hardware & Services
Saki Corporation has launched its next-gen series for SPI and AOI featuring a modular design for enhanced inspection efficiency and automation.
Read more...Yamaha’s Advanced Safety Package eases factory-safety Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Yamaha Robotics SMT Section has extended availability of the Advanced Safety Package, which contains optional features to elevate printer and mounter safety above and beyond mandatory levels.
Read more...X-band radar RF Design
Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.
Read more...GNSS antenna redefining what’s possible RF Design
Telecoms, Datacoms, Wireless, IoT
u-blox has achieved what was once thought impossible with the launch of the DAN-F10N, the industry’s smallest and most reliable L1, L5 dual-band GNSS antenna module.
Read more...u-blox expands NORA-B2 BLE modules RF Design
Telecoms, Datacoms, Wireless, IoT
The new nRF54L chipset-based wireless modules reduce current consumption and double processing capacity, catering to diverse mass market segments.
Read more...Case Study: Siemens Valor automation solution ASIC Design Services
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Electronics manufacturer BMK used Siemens Valor to enhance accuracy and speed up bill-of-materials quotations.
printer friendly version