19 February 2014Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has launched COOLSPAN thermally and electrically conductive adhesive (TECA) film providing reliable high-temperature performance. It is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heatsink coins and RF module housings.
The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical or press fit metal attachment. It provides both a thermally and electrically conductive bond interface. The film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
The material is able to survive lead-free solder processing and offers high chemical resistance and high temperature performance. It has been demonstrated to easily survive 5x lead-free solder exposures, 1000 hours at 85°C/85%RH, and 190°C for 10 days.
Soldering day highlights
Manufacturing / Production Technology, Hardware & Services
JAPAN UNIX has published a new event report and highlight video from their UNIX SOLDERING DAY 2026 in Hungary. This event reflects on their commitment to supporting manufacturers not only through soldering automation systems, but also through technical education, live demonstrations, hands-on training, and practical engineering know-how.
Read more...Clearing the Static: Electrostatic Discharge Actum
Manufacturing / Production Technology, Hardware & Services
A cordless ESD (Electrostatic Discharge) wrist strap does not work by grounding the person in the same way as a traditional wired wrist strap. Instead, it works by reducing or balancing the static charge on your body so that you are less likely to discharge electricity into sensitive electronic components.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Nordic expands nRF Cloud with firmware vulnerability scanning RF Design
Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
Read more...Engineering trust in South Africa’s SMT sector ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
From a small Johannesburg start-up to a trusted SMT technology partner, Zetech One has spent four decades helping South African electronics manufacturers improve production quality, efficiency and reliability.
Read more...The new reality of PCB material supply Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
How resilient manufacturing strategies are helping OEMs navigate a changing global supply chain.
Read more...Streamlining Device Programming with the AutoBee-D1 Vepac Electronics
Manufacturing / Production Technology, Hardware & Services
The AutoBee-D1 desktop automated programmer is designed to simplify the programming of devices, while delivering consistent accuracy, high throughput and reduced manual intervention.
Read more...Zero PFAS die attach paste Testerion
Manufacturing / Production Technology, Hardware & Services
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste.
Read more...Precision jet printing for advanced PCB designs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.
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