19 February 2014Manufacturing / Production Technology, Hardware & Services
Rogers Corporation has launched COOLSPAN thermally and electrically conductive adhesive (TECA) film providing reliable high-temperature performance. It is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heatsink coins and RF module housings.
The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical or press fit metal attachment. It provides both a thermally and electrically conductive bond interface. The film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
The material is able to survive lead-free solder processing and offers high chemical resistance and high temperature performance. It has been demonstrated to easily survive 5x lead-free solder exposures, 1000 hours at 85°C/85%RH, and 190°C for 10 days.
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