Form-in-place thermal interface

23 April 2014 Manufacturing / Production Technology, Hardware & Services

Gap Filler 4000 is Bergquist’s latest and highest performing dispensable thermal interface material, delivering thermal conductivity of 4,0 W/m-K and extended working time of up to four hours to provide greater flexibility in dispensing and assembly processes.

The two-part liquid material has shear thinning characteristics for optimum dispensing, and displays excellent wetting with ultra conformability to minimise stress on components during assembly. Ideal for filling unique and intricate air voids and gaps, it remains in place after dispensing and maintains its shape on the target surface.

Gap Filler 4000 has a low level of natural tack, and is intended for applications where a strong structural bond is not required. Cure time is 24 hours at room temperature or 30 minutes at 100°C. Unlike pre-formed gap fillers, this liquid dispensed material offers infinite thickness options and eliminates the need for specific pad thicknesses or die-cut shapes for individual applications.

For more information visit www.bergquistcompany.com

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