In July this year, TDK will commence mass production of a new series of soft-termination MLCCs that are specially designed to withstand flex cracking caused by bending stresses to a printed circuit board. The commercial grade MLCCs will be available in case sizes from EIA 0402 (1,0 x 0,5 mm) to EIA 3025 (7,5 x 6,3 mm) and with a wide range of capacitance values on a par with TDK’s other commercial grade MLCCs.
With these new types the soft-termination technology already proven in automotive grade components of the CGA series is now available for general-purpose applications as well.
In order to effectively absorb board stresses, TDK has designed these parts with an elastic conductive resin electrode material and advanced electrode forming technology. The result is a soft termination that is able to withstand a board deflection of up to 5 mm (over a length of 90 mm), making the joint 2,5 times stronger than that of standard MLCCs and all but eliminating the risk of flex cracking.
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