1 January 2015
Manufacturing / Production Technology, Hardware & Services
Electrolube’s HTSP heat transfer compound combines exceptional thermal conductivity with the very wide temperature range obtained by using silicone based oils. The formulation makes novel use of various metal oxide (ceramic) powders whose electrical insulation ensure that leakage currents cannot be created if the paste should come into contact with other parts of the assembly.
The compound should be used where a large amount of heat needs to be dissipated quickly and effectively. The heat from the source (e.g. semiconductor barrier layer) passes through many layers of different material before being dissipated through free or forced convection.
HTSP is a non-setting compound which allows easy rework of the components should this be necessary. It is specified across the -50°C to +200°C temperature range and is RoHS compliant.
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