Andon Electronics announced the launch of the BGA Rollerball socket and adaptor range, providing a convenient method for mounting ball grid array devices onto a printed circuit board (PCB).
A device is soldered to the adaptor – simplifying solder verification and testing – and the assembly then plugs into the BGA socket which is permanently soldered to the PCB.
With Andon’s Rollerball socket design, the critical distance between the terminal and the PCB pad is reduced, which ensures a better quality solder joint and connection. This also provides additional mechanical strength to connections as well as improved electrical connectivity.
The BGA adaptor is offered with either flat or countersunk heads, while the sockets can be surface or through-hole mounted. Socket insulators are made of FR-4 to withstand convection or IR soldering. The parts are available in virtually any size or configuration, using off-the-shelf or custom-designed, screw machined terminals.
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