12 August 2015Manufacturing / Production Technology, Hardware & Services
Koh Young Technology exhibited the latest in its offering of 3D inspection and quality assurance (QA) solutions at this year’s IPC/APEX expo, which was held in San Diego, USA in February. On display were the company’s solder paste inspection (SPI) systems (of which 6000 are installed worldwide), pre-and post-reflow 3D automatic optical inspection (AOI) systems, and the KSMART software that traces and analyses the root causes of defects.
Koh Young’s 3D SPI systems have established a reputation over ten years by delivering an authentic 3D inspection solution with high speed and accuracy for more than 1400 customers worldwide. From real-time board warp compensation to automated process feedback and control, these systems provide SMT manufacturers with advanced post-printing inspection. With its authentic 3D measurement capability, the Zenith AOI system can detect all types of defects with real measurement values, allowing much easier defect evaluation and process control.
The KSMART software solution connects inspection results from Koh Young’s 3D SPI and AOI systems so that the defect root cause can be traced, analysed and removed as early as possible in the process. By extending the process feedback capabilities that were offered on 3D SPI systems, KSMART now minimises defects even further by enabling communications between Koh Young’s 3D inspection systems.
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