Strain gauges for PCB reliability testing
12 August 2015
Test & Measurement
Manufacturing / Production Technology, Hardware & Services
Micro-Measurements released three new small-scale strain gauges designed to meet the growing demand for precise, stable and reliable stress analysis of PCBs, even in harsh environments.
The C2A-06-G1350-120 rectangular rosette gauge and C2A-06-015LW-120 uniaxial linear gauge are designed to detect PCB surface strains at critical locations in consumer electronics.
The miniaturisation of consumer electronics – and consequent increase in component density – results in larger thermal stresses, new requirements for surviving repeated loadings, and a greater need for impact stress survival. Meeting these specifications requires accurate knowledge of strains in the PCB and on-board components. Strain gauge measurement is the quickest, most accurate and most cost-effective method for identifying strains on a PCB, and can be used in developing loading fixtures and test plans to optimise the testing phase.
The C2A-06-G1350-120 is a stacked rosette gauge with a compact 5 mm diameter matrix and 3 m of three-conductor cable to eliminate lead wire soldering after bonding. Micro-Measurements’ Advanced Sensors strain gauge technology makes even smaller planar rosettes possible for use in surface mounting applications with restricted areas, as well as for intra-laminar strain measurement.
The uniaxial linear C2A-06-015LW-120 is supplied with pre-attached cables and features an active grid length of just 0,381 mm and an overall matrix of 1,4 x 1,9 mm. The device is ideal for installation on surface-mount components.
Cracks in the PCB and even across components, particularly around BGAs, can be induced by in-circuit test fixtures and during assembly, burn-in and testing, system integration, and packaging and shipping. Strain measurements should be made after all design iterations of the PCB, including changes to on-board components, which may alter thermal stress loading.
Combined with Micro-Measurements instrumentation and StrainSmart software, these strain gauges and accessories for PCB testing are IPC/JEDEC-9704 compliant and provide real-time data acquisition of board and component strains. This is especially useful when introducing new solder materials and processes, which may have a different stiffness and introduce a different soldering thermal profile.
For more information visit www.vishaypg.com/micro-measurements
Further reading:
Compact high precision magnetometer
Future Electronics
Test & Measurement
Bosch Sensortec has introduced the BMM350, a compact 16-bit, 3-axis magnetometer engineered to deliver high accuracy, low noise, and exceptional energy efficiency in space constrained designs.
Read more...
Ultra compact NTC thermistors
RS South Africa
Test & Measurement
Murata Manufacturing Co. has expanded its compact NCU03 series of NTC thermistors with two ultra-small 0603M devices tailored for consumer and automotive designs.
Read more...
Omniflex uses LoRaWAN to track water usage
Omniflex Remote Monitoring Specialists
Test & Measurement
Omniflex has helped New South Wales Ports improve its ability to track water usage by installing remote monitoring to 38 water meters at its Port Kembla site, sending the data to the NSWPorts web portal.
Read more...
Surviving the extremes: Understanding shock and vibration in MEMS sensors
Altron Arrow
Editor's Choice Test & Measurement
By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.
Read more...
Advanced pressure monitoring sensor
EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...
Slimline 150 W bench PSU
Vepac Electronics
Test & Measurement
The PeakTech P 6222 is the company’s new, slim laboratory power supply that offers precisely adjustable output values of 30 V and 5 A with a continuous power output of 150W.
Read more...
Redefining edge intelligence in RF analysis
Vepac Electronics
Test & Measurement
The HAROGIC PXR Series bridges the gap between benchtop-grade RF performance and high-performance edge computing.
Read more...
Otto Wireless appointed as sole agent for Dragino Technology
Otto Wireless Solutions
Test & Measurement
Dragino is a globally recognised leader in LoRaWAN and Internet of Things products and solutions, and is known for delivering reliable, cost-effective hardware.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
printer friendly version