Power Electronics / Power Management


High-density PIM

2 September 2015 Power Electronics / Power Management

New from ON Semiconductor is an 80 A Power Integrated Module (PIM) for demanding uninterruptible power supplies (UPS), industrial variable frequency drives and solar inverter applications.

Leveraging proprietary Trench Field Stop II technology along with rugged ultrafast recovery diodes, the NXH80T120L2Q0PG is configured in 1200 V, 80 A half-bridge and 600 V, 50 A neutral point clamp T-type topology, attaining efficiencies in excess of 98%.

The configurable package platform employs high-power, direct-bonded-copper substrate technology along with proprietary press-fit pins to provide a high-performance and reliable power module solution. The module is fully qualified to the highest industry standards for reliability at junction temperatures of 175°C.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



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