Aavid's slide-on heatsinks quickly and easily fit on DIP packages. They may be used with or without IC sockets. No glueing is nescessary as a locking catch prevents the heatsink from being dislodged.
The sinks have greater thermal efficiency since the unique design (patent pending) has two separate conduction paths - one on top and the other on the bottom of the DIP. Slotted fins minimise the boundary layer effect.
Double spring action brings top and bottom surfaces into contact with the DIP for a snug fit regardless of DIP thickness, for maximum thermal contact. Dynamic air flow design with staggered fins maximises the forced convection thermal performance. Very little additional board space is required.
Reliable power solution Conical Technologies
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Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
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